Introduction of a wide lineup of 4-probe probes for achieving high resistivity measurements. Comprehensive product support available. *Materials provided.
Micro Point Pro's "4-Needle Probe (Contact Probe)" features high-quality high-speed steel, characterized by extremely low resistance values. The tip uses carbide and osmium alloys, allowing for choices in durability and electrical contact properties. The probe body offers a reliable solution for resistivity measurement with the "Fell Probe (Chrome-Plated Body)," as well as two other types: "Disposable Probe (Plastic Body)" and "Al Probe (Aluminum Body)." 【Features】 ■ Low-friction upper guide ■ Wide selection of probe tip radii ■ Individual needle pressure adjustment ■ High breakdown voltage and low leakage
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basic information
【Other Features】 ■ Ruby guide can be inserted into the brass lower guide ■ Tungsten carbide or osmium alloy needle tip ■ Repair and configuration services * You can download the English version of the catalog. * For more details, please refer to the PDF materials or feel free to contact us.
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【Applications】 ■ Measurement of resistivity of silicon ingots ■ Four-point measurement of wafer resistivity ■ Four-point measurement of epitaxial layers, ion-implanted layers, and diffusion layers ■ Four-point measurement of metal films and other films * You can download the English version of the catalog. * For more details, please refer to the PDF document or feel free to contact us.
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Company information
Micro Point Pro Ltd (MPP) was established in 2010 following the acquisition of the backend tool manufacturing line from Kulicke & Soffa (K&S). This acquisition included knowledge and know-how supported by highly skilled employees with over 40 years of experience. Since then, MPP has established itself as a global leader in both backend and frontend in the semiconductor market. We have been able to provide comprehensive solutions to meet the evolving needs of our customers through the development and acquisition of additional manufacturing processes. MPP has the capability and expertise to respond to the demand and support for high-precision consumable tools in the microelectronics industry. Our products cover all major packaging processes and applications, specializing in probe head solutions for resistance measurement testing of wafers or thin conductive films.