Modular PC compatible with 9th/8th generation Core i CPUs for factory automation (FA).
Features ■ Width 241.5 × Height 92.6 × Depth 230 mm, 5.14 liters ■ 9th/8th generation Core i7/i5/i3 Desktop (TDP 35W/65W) LGA1151 CPU ■ 2 DDR4 2400/2666, maximum 64GB ■ Modular PC; can be converted to a panel PC using an LCD module. ■ 3 display outputs: VGA, DVI, DP ■ 3 GbE / 6 USB 3.2 / 6 COM / 1 DI + 1 DO ■ 2.5" SATA HDD x 4 (front operation) / 2 (1 front operation) / CFast x 2 / mSATA x 2 ■ Wide DC input 9–48V ■ Extended operating temperature -40–70℃ (CPU TDP 35W)
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basic information
Specifications ■CPU: 9th/8th Generation Core i7/i5/i3 Desktop (TDP 65W/35W) LGA1151 ■Memory: DDR4-2666/2400 SODIMM x 2 (up to 64GB) ■Storage: 2.5" SATA HDD x 4 (front access), CFast x 2, mSATA x 2 ■I/O Connectors: 8 (6x USB 3.2, 2x USB 2.0), 6x COM, 10/100/1000Base-T x 3 (RJ45), GPIO, Audio, CMOS Battery, Universal I/O Bracket, VGA, DVI, DP ■Expansion Slots: PCIe Mini x 2 ■Power Supply: 9–48V DC ■Dimensions (W x H x D) / Weight: 241.5 x 92.6 x 230 mm / 4.1 kg ■50 Grms, Half-sine 11 ms ■5 Grms, 5-500 Hz, 3 Axis ■Certification: CE/FCC
Price information
Open price
Delivery Time
※It may vary depending on the quantity and timing, so please feel free to contact us.
Applications/Examples of results
Factory, machinery, etc.
Line up（10）
| Model number | overview |
|---|---|
| MERA-3120 | Intel 9th/8th LGA 1151 Fanless PC with 3x LAN, 6x USB 3.0, 2x USB2.0, 6x RS232/422/485, 1x DVI-D, 1x DP, 1x VGA, 3x Universal I/O Brackets, 4x Removable 2.5” SATA HDD Bays |
| MERA-3110-3L | Intel 9th/8th Core i LGA1151 CPU, Q370 Fanless PC, 6x USB3.0, 2x USB2.0, 3x GbE, 6x RS232/422/485, 1x DP, 1x VGA, 1x DVI-D, 1x Flexible I/O Window Slot, 4x Removable 2.5” SATA HDD Bays, DC 9~48V |
| MERA-3110-7L | Intel 9th/8th Core i LGA1151 CPU, Q370 Fanless PC, 6x USB3.2, 2x USB2.0, 6x RS232/422/485, 7x GbE, 1x DVI-D, 1x DP, 1x VGA, 1x Flexible I/O Window Slot, 4x Removable 2.5” SATA HDD Bays, DC 9~48V |
| MERA-3110-3L-4P | Intel 9th/8th Core i LGA1151 CPU, Q370 Fanless PC, 6x USB3.2, 2x USB2.0, 6x RS232/422/485, 3x GbE, 4x PoE+, 1x DP, 1x VGA, 1x DVI-D, 1x Flexible I/O Window Slot, 4x Removable 2.5” SATA HDD Bays, DC 9~48V |
| MERA-3110-3L-4ML | Intel 9th/8th Core i LGA1151 CPU, Q370 Fanless PC, 6x USB3.0, 2x USB2.0, 6x RS232/422/485, 7x GbE (3x GbE with RJ45 + 4 GbE with M12), 1x DP, 1x VGA, 1x DVI-D, 4x Removable 2.5” SATA HDD Bays, DC 9~48V |
| MERA-3110-3L-4MP | Intel 9th/8th Core i LGA1151 CPU, Q370 Fanless Box PC, 6x USB3.0, 6x RS232/422/485, 3x GbE, 4x PoE+ with M12, 1x Flexible I/O Window Slot, 4x Removable 2.5” SATA HDD Bays, DC 9~48V, Terminal Block Connector |
| MERA-3110-11L | Intel 9th/8th Core i LGA1151 CPU, Q370 Fanless PC, 6x USB3.0, 2x USB2.0, 6x RS232/422/485, 11x GbE, 1x DP, 1x VGA, 1x DVI-D, 1x Flexible I/O Window Slot, 4x Removable 2.5” SATA HDD Bays, DC 9~48V |
| MERA-3110-3L-8P | Intel 9th/8th Core i LGA1151 CPU, Q370 Fanless PC, 6x USB3.0, 2x USB2.0, 6x RS232/422/485, 3x GbE, 8x PoE+, 1x DP, 1x VGA, 1x DVI-D, 1x Flexible I/O Window Slot, 4x Removable 2.5” SATA HDD Bays, DC 9~48V |
| MERA-3110-3L-8ML | Intel 9th/8th Core i LGA1151 CPU, Q370 Fanless PC, 6x USB3.0, 2x USB2.0, 6x RS232/422/485, 11x GbE (3x GbE with RJ45 + 8x GbE with M12), 1x DP, 1x VGA, 1x DVI-D, 4x Removable 2.5” SATA HDD Bays, DC 9~48V |
| MERA-3110-3L-8MP | Intel 9th/8th Core i LGA1151 CPU, Q370 Fanless PC, 6x USB3.0, 2x USB2.0, 6x RS232/422/485, 3x GbE, 8x PoE+ with M12, 1x DP, 1x VGA, 1x DVI-D, 1x Flexible I/O Window Slot, 4x Removable 2.5” SATA HDD Bays, DC 9~48V |
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Company information
Currently, Taiwan has become a global supply base for industrial electronic equipment, and we aim to contribute to the development of Japanese industry by providing excellent industrial electronic equipment from Taiwan to Japanese engineers. As a specialized trading company for industrial electronic equipment, we will supply the necessary industrial electronic devices (LCD displays, LCD modules, embedded PCs, AI embedded PCs, panel PCs, CPU boards, measurement and control boards, network devices, video equipment, GPS devices, wireless transmission devices, IoT sensors) to engineers.
