A special substrate that is joined to a metal base by thermal pressing beneath the substrate. The through-hole section can be joined to the metal base by copper plating.
A solder plating or tin plating is applied in advance under the substrate, and by thermally bonding it to the metal plate, a complete surface joint is provided. It is also possible to use high-frequency compatible substrates made of low dielectric materials or substrates made of fluororesin. Such combinations can provide a very effective heat dissipation structure for high-frequency applications. Additionally, it is also effective for EMI countermeasures in RF applications.
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basic information
The substrate material for the board can be anything from standard FR-4 to low dielectric materials or even fluoropolymer substrates, depending on your preference. Our company offers a range of overseas materials, including low dielectric materials, which are more cost-effective compared to domestic substrates while providing equal or superior electrical properties.
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Applications/Examples of results
High-frequency substrates compatible with millimeter waves, particularly areas expected to have advanced heat dissipation and good GND connections, such as those handling the final RF stage.
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Company information
Morimar SSP Co., Ltd. is engaged in the development, manufacturing, processing, and sales of various synthetic resins and chemicals, as well as their raw materials. Utilizing the production systems of the Morimar Group both domestically and internationally, we are expanding our global initiatives across a wide range of products, including FRP raw materials and molded products, glass fibers, printed circuit boards, resin raw materials, and functional films, targeting markets both in Japan and abroad.