Are you having trouble with heat management for your equipment? There are many applications, including energy, electronic devices, and medical and testing equipment! Let us introduce the heat management devices we offer.
WELCON Co., Ltd. specializes in the production of "thermal management devices." The development of microchannel products using diffusion bonding technology has achieved "high efficiency" and "miniaturization" in thermal management devices. These can be utilized in energy-related equipment, electronic devices, medical devices, and inspection equipment. If you are struggling with thermal management for your equipment, please feel free to consult us. Additionally, you can view materials that not only introduce the thermal management devices we handle but also provide information about microchannels through the "PDF Download." We encourage you to take a look. 【Contents of the materials】 ■ What is a microchannel? ■ Introduction to microchannel thermal management devices ・ Microchannel heat exchangers ・ Microchannel heat sinks (water-cooled) ・ Vapor chambers (VC) *For more details, please refer to the PDF materials or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
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【Example of Related Achievements (Excerpt)】 ■ Aerospace ■ Chemical Plants ■ Printing Machines ■ Fuel Cells ■ Electronic Devices ■ Semiconductor Manufacturing Equipment ■ Information Communication and Antennas, etc. *For more details, please refer to the PDF document or feel free to contact us.
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High-performance, compact, lightweight, and thermal management components provided through fine diffusion bonding technology, contributing to energy savings. Not just bonding, but also one-stop shopping for structural design, thermal fluid design, and more. We accommodate everything from prototype single items to mass production. Capable of fine three-dimensional structures, surface bonding, laminated bonding of thin plates, and bonding of dissimilar materials. Suitable for mass production of prototypes for 3D laminated structures and 3D printers. Applicable to hollow components, fine three-dimensional structures, high-pressure and high-efficiency heat exchangers with fine flow paths, high-efficiency heat sinks, reactors, mixers, and more. Extensive experience and proven results in providing solutions across various industries, including automotive, medical devices, semiconductor manufacturing equipment, food equipment, special inspection devices, power, and electrical/electronic components. For more details, please contact us.