Compatible with various types of target materials using different manufacturing methods! Backing plates can also be produced.
The sputtering method accelerates ionized molecules and atoms to collide with a material, depositing the ejected material as a thin film on a substrate, and this material is called the target. The shape of the target is determined by the device, and it can be rectangular, cylindrical, etc. Generally, bonding-type targets with the material attached to a backing plate are used, but particularly for cylindrical targets, there are also bonding types, thermal spray types, and monolithic types. We provide suitable types for each target material. [Shapes (Manufacturing Methods)] ■ Cylindrical (Bonding) ■ Cylindrical (Monolithic) ■ Cylindrical (Thermal Spray) ■ Flat (Bonding) *For more details, please refer to the PDF document or feel free to contact us.
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【Features】 ■Cylinder (Bonding) - Dense film made from high-density material - Uses special bonding material ■Cylinder (Integrated) - High input capability due to absence of bonding material ■Cylinder (Thermal Spraying) - Fast film formation rate - Large targets possible (up to L4000mm) ■Flat (Bonding) - Dense film made from high-density material - Uses special bonding material - Various shapes available, including rectangular, disc, and stepped shapes *For more details, please refer to the PDF document or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
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Our company has affiliated companies in China and South Korea, and we are capable of researching, procuring, and supplying products that we do not manufacture directly. Based on our extensive track record, our staff, who are proficient in Chinese, Korean, and English, will respond to our customers' requests. Additionally, in order to meet various requests from users, our technical department collaborates with related companies to improve existing products and develop new ones.