Achieving high flatness with high durability for CMP cloth! Introduction to CMP cloth.
"CMP Cross" is a cloth for CMP made by bonding polyurethane to a non-woven fabric composed of special polyester fibers. It achieves high flatness on the processing surface and high durability of the cloth, making it possible to perform polishing based on the backside of the substrate for mirror finishing of compound semiconductors and removal of oxide films. It is also suitable for the final process in polishing and for mirror finishing of edges. 【Features】 ■ Non-woven fabric made from special polyester fibers bonded with polyurethane ■ Achieves high flatness on the processing surface and high durability of the cloth ■ Suitable for use in the final process of polishing ■ Enables polishing based on the backside of the substrate ■ Removes fine scratches that cannot be eliminated in the polishing process of polishing cloths *For more details, please refer to the PDF document or feel free to contact us.
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basic information
【Specifications】 ■Material: Special Polyester, Polyurethane ■Outer Diameter: Φ150mm, Φ200mm, Φ300mm, Φ381mm ■Quantity: 5 pieces/set ■Thickness: t1.55mm ■Density: 0.32g/cm3 ■Hardness (C): 72 ■Compression Ratio: 4.0% ■Compression Elasticity Ratio: 80% ■Abrasive: Colloidal Silica Abrasive, Chemical Liquid, etc. ■Applicable Particle Size: 0.015μm to 0.0825μm ■Process: CMP Polishing 【Examples of Materials with Processing Experience】 ■Semiconductor Materials (Silicon, Germanium, Silicon Carbide, Strontium Silicate, Gallium Arsenide, Indium Gallium Arsenide, Indium Phosphide, Indium Gallium Zinc Oxide, Gallium Nitride, Gallium Oxide, Cadmium Telluride, etc.) ■Optical Materials (Quartz Glass, Sapphire, Fluorite Lens, Spinel, Phosphate Glass, Lithium Borate, Acrylic Resin, (CLBO, YiG, GGG, etc.) ■Ceramic Materials (Alumina, Zirconia, Silicon Nitride, Ferrite, etc.) ■Metal Materials (Steel Materials, Stainless Steel, Copper, Gold, Silver, Platinum, Aluminum, Titanium, Molybdenum, etc.) *For more details, please refer to the PDF document or feel free to contact us.
Price range
P2
Delivery Time
P3
Applications/Examples of results
【Applications】 ■ CMP polishing of interlayer insulating films on device wafers ■ CMP polishing of metal wiring ■ CMP polishing of compound semiconductors such as SiC, GaN, and Ga2O3 *For more details, please refer to the PDF document or feel free to contact us.
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Company information
Our company has been manufacturing polishing equipment, cutting machines, and scribers suitable for precision machining using the technical know-how we have cultivated over many years. We have a significant track record, particularly in cutting-edge technology fields such as semiconductors, ceramics, and optical communications. In addition to standard specification equipment, we also accept the design and manufacture of custom specifications tailored to our customers' needs. To meet the increasing demands for precision in machining and the diversifying needs, we will continue to advance with innovative ideas and technology.