Achieved over 90% market share in Asia, Europe, and America!
Our company offers a "Vacuum Pressure Curing System" that achieves high-quality and low-cost mass production through complete void removal. It can dissolve and reduce voids caused by physical factors during the application, mounting, and printing processes, as well as voids caused by volatiles during curing. In particular, it demonstrates high effectiveness in narrow gaps and narrow pitches, where void reduction is difficult with conventional ovens. 【Features】 ■ Expansion of material margins through vacuum and pressure systems ■ Improved voidlessness, filling, and adhesion ■ High productivity ■ Establishment of a competitive process *For more details, please download the PDF or feel free to contact us.
Inquire About This Product
basic information
For more details, please download the PDF or feel free to contact us.
Price range
Delivery Time
Applications/Examples of results
For more details, please download the PDF or feel free to contact us.
catalog（1）
Download All Catalogs
Company information
Our company handles a variety of products, including vacuum and pressure ovens, formic acid reflow devices, SEM, and AOI inspection machines. We are also expanding our business globally in places like Taiwan and China. Please feel free to contact us first.