It is an adhesive that can cure at lower temperatures and in a shorter time compared to typical one-component epoxy adhesives.
The low-temperature fast-curing epoxy adhesive "A-2201BKLC" has the following features: 【Features】 ■ Can cure at low temperatures of 70-80°C. ■ Can cure in a short time of 30-60 minutes. ■ Compliant with low halogen standards.
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basic information
【Representative Physical Properties】 Appearance: Black liquid Viscosity (mPa.s): 55,000 Recommended Curing Conditions: 70℃/60 minutes or 80℃/30 minutes Tensile Shear Adhesion Strength (N/cm2 SPCC): 1,400 Tensile Shear Adhesion Strength (N/cm2 Aluminum): 1,000
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【Purpose】 ■ It is suitable for bonding components that should not be subjected to high temperatures.
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Company information
Our company develops, manufactures, and sells epoxy and acrylic resin-based adhesives. Our resin products are used in various fields, from bonding and protecting electronic components to fixing and adhering civil engineering materials. Each product is unique, and we respond to customer requests through development and customization. If you have requests or concerns such as "I want an adhesive with specific features" or "I can't find what I want in mass-produced items," please feel free to consult with us! Additionally, our company is committed to creating and managing products with consideration for environmental substance regulations. With our meticulous and speedy response, we support your development and production. For more detailed product information, please visit our corporate website via the "Official Site" link at the top left or the URL below. https://www.resinous-kasei.co.jp/
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