Lasers in the order of picoseconds (10^-12 seconds) and femtoseconds (10^-15 seconds) are called ultrashort pulse lasers.
Among laser light, those that repeatedly blink at short intervals are called "pulse lasers." Among them, lasers with a short emission time (duration), particularly those in the pico (10^-12) second or femto (10^-15) second range, are referred to as ultra-short pulse lasers. In 2018, Dr. Gérard Mourou and Dr. Donna Strickland, who devised and demonstrated a method called CPA (Chirped Pulse Amplification), were awarded the Nobel Prize in Physics. This was 33 years after the first paper was published in 1985. While the details are omitted here, this technology significantly contributed to the development of short pulse and high intensity in pulse lasers. By the 1990s, ultra-short pulse laser processing began to be actively researched in research institutions around the world. From the 2010s, fiber-excited ultra-short pulse lasers started to be commercially available as industrial lasers. The laser oscillators we have introduced are these industrial picosecond and femtosecond lasers.
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Why is ultra-short pulse processing beneficial? Laser processing fundamentally utilizes the reactions that occur when light is absorbed by a material. When thinking of laser processing, one might imagine a beam hitting an object, causing it to melt, create holes, or cut, which is known as "thermal processing." In contrast, what we offer is a type of processing called "non-thermal processing." (Note: The thermal effects can vary depending on how the irradiation is done.) The mechanism behind this is that the time it takes for energy to be converted into heat is said to be about 10 picoseconds, and by processing in a time shorter than that, we can minimize thermal effects. This results in reduced damage (such as burrs, cracks, and burns). Therefore, in general, to minimize thermal effects, the pulse width is shortened. In our pico-second laser processing, the pulse width is <15 picoseconds, and by using femtosecond lasers, we achieve high-precision processing tailored to your quality requirements.
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◆Precision machining of difficult-to-cut materials and complex shapes ◆Automotive parts, medical device parts, electronic components, semiconductor parts ◆Prototype and development projects Leave it to us. We handle everything from processing to equipment setup. Hikari Machinery Manufacturing Co., Ltd. ■HIKARI LASER LAB. 〒277-0882 Chiba Prefecture, Kashiwa City, Kashiwa-no-ha 5-chome 4-6, Room 511, Tokatsu Techno Plaza Tel. 0471-70-4866 Fax. 0471-70-4866 E-mail: info@hikarikikai.co.jp HP: https://www.hikarikikai.co.jp/ Satellite site: https://tyotannpulselaser.com/
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At "HIKARI LASER LAB.", we offer services for precision processing using ultra-short pulse lasers, including "contract processing," "development agency," and "marking." Precision processing and surface modification/internal marking using picosecond and femtosecond lasers are utilized in various industrial equipment across sectors such as the medical industry, automotive industry, and semiconductor industry. Recently, there has been a demand for surface modification not only for shape processing like fine hole drilling, cutting, trimming, and groove processing but also for enhancing functionalities such as water repellency, release properties, friction reduction, and improved sliding properties. Additionally, there is a demand for marking inside glass from the medical industry. Laser processing is possible on a wide range of materials, including transparent materials like glass and diamonds, difficult-to-cut materials like titanium, and resins, CFRP, ceramics, and polyimides. Regarding surface modification, we have received requests to improve the release properties of molds. We will continue to "challenge" ourselves in precision processing and surface modification using ultra-short pulse lasers to meet our customers' needs!