Material for grinding carriers
Grinding carrier
The bending strength and elastic modulus are very high, making it suitable for use under high torque.
To achieve the strict flatness required for silicon wafers, which are substrate materials for semiconductors, and magnetic heads inside HDDs, processing with polishing equipment is necessary. The polishing carrier serves as a fixture to hold the product while the polishing equipment processes it. A commonly used resin material for polishing carriers is glass epoxy (epoxy glass), which has very high bending strength and elastic modulus, making it suitable for use under high torque. We handle epoxy glass laminated sheets (such as Sumitomo Bakelite's EL-3700) that excel in thickness precision and mechanical strength, suitable for various polishing carrier applications including silicon wafers, hard disks, and LCD glass. Myojo Electric provides a one-stop solution from material selection and procurement of thermosetting resins, including glass epoxy, and engineering plastics, to various processing methods such as cutting, molding, polishing, bending, and bonding. If you have any questions or inquiries, please feel free to contact us.
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basic information
【Material Sales】 ○ Thermosetting resin laminated boards and molded boards ○ Thermosetting resin laminated round bars and pipes ○ Insulation boards ○ Thermoplastic resins and general-purpose plastics ○ Engineering plastics ○ Super engineering plastics ○ Copper-clad laminated boards ○ Adhesive and bonding tapes ○ Functional films ○ FPC materials 【Processing and Manufacturing】 ○ Precision punching processing (various laminated boards, plastic sheets, ultra-thin metal sheets) ○ Precision die-cutting of adhesive tapes and films ○ Precision cutting processing ○ Functional film lamination processing ○ Optical film curved surface vacuum lamination processing ○ Jig and equipment contract development ● For more details, please contact us or download the catalog.
Price information
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Delivery Time
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Applications/Examples of results
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Company information
Seiko Electric Co., Ltd. was founded in 1947, shortly after the war. Initially, we only sold insulating materials, but in response to customer requests, we began to offer processing services such as cutting, bending, and laminating. By utilizing our sales and production bases both domestically and internationally, we have been able to provide comprehensive support for our customers' businesses through services ranging from material sales to planning, proposals, processing, and logistics. We continuously challenge ourselves with new technologies in various fields, including smartphones, tablets, display devices, automotive parts, robots, measuring instruments, wearable devices, medical equipment, aerospace, manufacturing equipment, and power electronics, responding to customer needs from material sales to resin processing, tape and film processing, and vacuum lamination processing. Additionally, leveraging our global network for sourcing materials from overseas and supplying materials to overseas factories, we support all phases of "manufacturing," from material procurement to prototyping and mass production, including proposals for transitioning to mass production at our factory in the Philippines after prototyping and small-lot production at our Shirakawa factory.