Exhibiting excellent resistance to thermal shock! Introducing resin materials for optical applications and adhesives for UV-C applications.
We would like to introduce the products we handle, "HE59/HE60F-4." "HE59" is a high-transparency resin material for optical applications, and due to its relatively low hardness, it exhibits excellent properties for relieving thermal stress and resistance to thermal shock when bonding dissimilar materials. "HE60F-4" is a UV-C (deep ultraviolet) resistant adhesive material for UV-C applications, which is resistant to the short wavelengths of UV-C light and can be applied to high-output ultraviolet LED bonding materials. [Features] <High-transparency resin material for optical applications HE59> ■ High transparency, clear material ■ Usable as an adhesive ■ Excellent thermal stress relief and resistance to thermal shock ■ Can be supplied as a single component if heat treatment at high temperatures is possible *For more details, please refer to the PDF document or feel free to contact us.
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【Other Features】 <UV-C (Deep Ultraviolet) Resistant Adhesive HE60F-4 for UV Applications> ■ Fluorine-containing sealing and bonding material for LEDs ■ Resistant to short-wavelength light of UV-C (wavelengths below 300nm) ■ Can be applied to high-output ultraviolet LED bonding materials ■ Two-component type with base agent and hardener *For more details, please refer to the PDF document or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
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Since its founding in 1949, we have developed our business based on the glass material technology and glass-to-metal sealing technology (GTMS) cultivated through glass products for vacuum tubes. Building on this accumulated technology, we have also aligned our innovations from vacuum tubes to semiconductors, and as a result of continuously providing various components that respond to the integration of light and electronics, our technology has now borne fruit in three business areas: "glass components for electrical and electronic devices," "optoelectronics packaging components," and "glass ceramics (LTCC)."
