Soldering defects: Flux scattering, solder balls (solder with resin)

basic information

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Detailed information

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  Flux scattering is a common issue during work with solder containing flux. In addition to damaging the appearance of the product, flux that adheres to other components such as LCD screens, camera units, and switch contacts can lead to product malfunctions.

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  Causes of Flux Spattering Flux spattering occurs when low boiling point and low decomposition point components in the flux boil and gasify due to the heat during soldering, leading to an explosion simultaneous with solder melting. Factors that make spattering more likely include the following: - Not selecting the appropriate solder for the task - The soldering iron temperature is too high - The speed of solder delivery is too fast - The working location is at a high altitude (surrounding air pressure is low)

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  Solder balls are likely to occur simultaneously with flux scattering. They can occur when solder is fed too quickly, as well as when the movement of the soldering iron is too vigorous or when there is an excessive amount of solder.

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  Selection of Solder Materials By implementing measures such as increasing the melting viscosity of the flux and using materials with low gasification, it is possible to reduce scattering caused by solder materials. At our company, we offer low-scatter solder suitable for: - Hand soldering - Laser soldering - Robot soldering - High-altitude locations (areas with high elevation and low atmospheric pressure) Please contact us for more information.