A new technology for non-contact heating implementation using electromagnetic induction: "IH Reflow Technology."

Prototyping is possible! Non-contact soldering that can mount electronic components on low heat-resistant substrates such as PET, fabric, and paper! Achieving damage-free and 100% yield mounting instantly.

"IH Reflow" is a mounting technology that applies IH (induction heating), enabling instant, non-contact mounting of only the necessary parts without physical stress, allowing for damage-free implementation. This technology makes it possible to mount electronic components that are not heat-resistant on low-heat-resistance substrates such as inexpensive, flexible, and stretchable PET, paper, and fabric. Additionally, by applying this technology, it can replace the conventional mounting processes on high-heat-dissipation substrates that typically use lasers or manual soldering, dramatically improving production throughput. Sales of IH Reflow devices, bonding experiments, prototype contracting, and unique contract mounting services based on the core technology "IH Reflow" are also available. 【Features】 - Damage-free component mounting technology for low-heat-resistance and high-heat-dissipation substrates - Heating and mounting using electromagnetic induction - Achieves instant, damage-free, non-contact mounting at specific locations with a yield of 100% - Heating method: Induction heating only at the mounting points (single point to multiple points) - Capable of mounting on low-heat-resistance substrates and high-heat-dissipation boards *For more details, please refer to the PDF materials or feel free to contact us.

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