Streamlining the application of sealing tape for MEMS sensors (case study publication)
In the MEMS manufacturing/assembly process, film lamination is necessary... It can also be used for the automation and labor-saving of sealing tape with few adhesion points (at the edges)!
Even though it is called MEMS, it is widely active in the world. This time, what our company is focusing on is the automation and labor-saving of sealing tape to protect MEMS microphones and other devices from contamination by fine particles and splashes of soldering liquid. You may want to apply sealing tape, but the cost doesn't add up for manual application... You want to automate it, but you don't know how to peel it off... There are various barriers to automation and labor-saving. The Film Feeder we provide can transport fine tapes of 1×1mm and tapes that are difficult to peel off due to lack of stiffness. If you are considering automating and labor-saving for the application of waterproof breathable films, please check our materials. *For more details, please refer to the PDF document or feel free to contact us.
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【Specifications】 ■Peeling work size: Work transfer and bonding to any position from 1×1mm to 25×30mm ■A system has been established for producing test work and conducting bonding experiments and verifications. 【Examples of Seal and Tape Usage】 ■Attachment of reinforcement plates ■Attachment of PI (Polyimide) ■Bonding processing ■Noise countermeasures / Attachment of shielding materials ■Attachment of cover layers ■Assembly of flexible antenna reflective materials ■Multi-layer assembly of FPC ■Attachment of waterproof breathable films to MEMS microphones and sensors ■Attachment of cushioning materials to housings and contact parts ■Attachment of mechanical parts / waterproof seals ■Assembly of optical units (light guides, diffusion films, etc.) *For more details, please refer to the PDF document or feel free to contact us.
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【Purpose】 ■Peeling of fine work mounted on PET film *For more details, please refer to the PDF document or feel free to contact us.*
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Our company is focusing on creating new value in manufacturing by leveraging our two strengths: "measurement and control technology" and "design and assembly technology for precision equipment parts." In the field of non-destructive inspection equipment for fruits and vegetables, where we have accumulated technology as a pioneering company for many years, we have expanded our focus from traditional measurements centered on the sugar content of fruits to inspections of internal rot, cavities, and browning in vegetables. By developing machines that can accurately inspect fruits and vegetables, which have variations in shape and quality, even under harsh usage conditions, we are making a significant contribution to the quality assurance of internal produce in Japanese agriculture. Additionally, in the field of electronic component mounting, we have been engaged in OEM and ODM production of tape feeders and surface mount technology for over 30 years, featuring production facilities that can flexibly accommodate everything from small quantities of diverse products to mass production. Recently, we have also developed original splicing jigs that realize labor-saving in board mounting, leveraging our long-standing technology and experience. This has already attracted inquiries from many companies and received high praise from the market.