What is the technology 'MID' that replaces PCB and FPC for miniaturization of resin molded products?
MID enables wiring formation that does not rely on circuit boards or harnesses, contributing to thinner, smaller, and lighter designs through the reduction of component count.
3D-MID refers to molded circuit components that directly incorporate wiring into plastic injection molded products. By three-dimensional wiring of the housing as part of the printed circuit board, it enables the miniaturization, thinness, lightweight, and enhancement of product functionality. Currently, there are mainly two types of methods for 3D-MID: the two-shot molding method and the laser method. Within these two types, there are several additional techniques. 【Features of MID】 - Direct wiring and component mounting on the housing enable miniaturization, thinness, and lightweight design. - Reduction in the number of components (material savings). - Reduction in assembly labor. - Cost reduction due to the decrease in the number of components and assembly labor. - By combining printed circuit boards with 3D-MID, it addresses the high-density products that cannot be managed by printed circuit boards alone. *For more details, please refer to the related links or feel free to contact us.
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basic information
[MID Manufacturing Process Sample (LDS Method)] ■ 3D circuit design and component placement using the MID design tool "Nextra" ■ Injection molded products (creating enclosures with engineering plastics) ■ Forming circuit patterns on the surface of the enclosure through laser processing ■ Applying gold plating to the circuit patterns through plating processing ■ Component mounting *For more details, please refer to the related links or feel free to contact us.
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Applications/Examples of results
【Examples of Use】 ■ Automotive steering switches ■ Motorcycle handle switches ■ Antennas for mobile devices such as mobile phones and smartphones ■ Wireless radar modules for automotive collision prevention systems ■ Electromagnetic shields to prevent electromagnetic wave leakage ■ Miniaturization and lightweighting of medical devices (e.g., hearing aids, dental medical instruments) Note: There are limitations on the plastic materials that can be molded. *For more details, please refer to the related links or feel free to contact us.
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Company information
Our company was established in 1969 as a company that creates artwork for printed circuit boards and mask films. Since then, we have built a track record and position in the artwork industry under the slogan "Great Britain of Technology." Currently, we are exploring limitless possibilities in the fields of printed circuit boards, CAE, CAD, CAM, and CAT, with an eye on the next generation. We are responding to technological innovations, establishing a sales system that is responsive to the new era, and building a consistent service system. Furthermore, as a group that opens the future, we are always conscious of being at the best level in the industry and promise to prioritize "customer satisfaction" in our actions. Additionally, since 2003, we have joined the Muto Seiko Group, which focuses on manufacturing plastic injection molded parts as our main business, and we will continue to work sincerely with all employees in mind for broad development.