Essential electroless plating technology for the implementation of power devices, backed by 20 years of know-how!
Our company performs electroless NiP/Au plating on semiconductor wafer Al electrodes, primarily focusing on power semiconductors for automotive applications. To meet customer requirements, we have designed a unique plating cassette and circulation mechanism to improve wafer surface uniformity. Additionally, by achieving a uniform film thickness distribution, we can reduce the inter-chip variation in phosphorus content within the nickel and minimize the variation in nickel consumption during solder mounting. 【Features】 ■ Unique fixtures and equipment that achieve uniform film thickness distribution ■ Reduction of variation in nickel consumption during solder mounting ■ Large equipment compatible with 12-inch wafers ■ Plating suitable for high-temperature mounting/high thermal resistance ■ Electroless copper plating for power devices *For more details, please refer to the PDF document or feel free to contact us.
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【Supported Materials】 ■Materials: Power semiconductors such as Si, SiC, GaO, GaN ■Al-based electrodes: Pure Al, AlSi, AlSiCu, AlCu *For more details, please refer to the PDF document or feel free to contact us.
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Applications/Examples of results
【Applications】 ■ Power devices for automotive and home appliances ■ Sensor devices ■ ASIC devices for MEMS, etc. *For more details, please refer to the PDF document or feel free to contact us.
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Through the miniaturization of products using our unique nano-plating technology, we promote resource conservation and energy efficiency to protect the global environment, ensuring that even hundreds of billions of components can be produced without a single defect, thereby providing safety and peace of mind to society. This philosophy will be passed down forever as long as the company continues, regardless of how times change. Kiyokawa Plating will continue to provide technology that is always needed by our customers, ensuring their satisfaction and inspiring them.