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  6. Electroless plating technology for substrates

Electroless plating technology for substrates

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last updated:Dec 24, 2021

清川メッキ工業
清川メッキ工業
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It is possible to electroplate the electrodes of a substrate with a cavity structure using independent pads!

Our company strives to minimize Ni corrosion (black pad) caused by replacement Au plating and provides a coating with bonding strength that satisfies our customers. Since it is an electroless plating process, it is possible to plate the electrodes of substrates with independent pads and cavity structures. We propose plating films for Ni and Au plating that are tailored to the environment in which the products will be used, such as solder joints and wire bonding. 【Features of Electroless Ni Plating Coating】 - Uniform plating film can be obtained without edge effects, unlike electroplating. - Excellent film thickness uniformity makes it suitable for products with complex shapes. - Can achieve greater hardness compared to electro Ni plating. - Superior corrosion and wear resistance. - Depending on the P concentration, it is also possible to impart non-magnetic or magnetic properties to the coating. *For more details, please refer to the PDF document or feel free to contact us.

    Surface treatment contract service
基板への無電解めっき.jpg

Electroless plating technology for substrates

基板への無電解めっき.jpg
基板への無電解めっき.jpg
  • Related Link - https://www.kiyokawa.co.jp/technology/detail10

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basic information

【Supported Materials】 ■Electrode Materials: Cu, Ag ■Plating Thickness  ・Ni (1 to 10μm)  ・Au (0.05 to 0.4μm) ■Substrate Size  ・Cu electrode products: approximately 200mm square  ・Ag electrode products: approximately 130mm square *For more details, please refer to the PDF document or feel free to contact us.

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Applications/Examples of results

【Applications】 ■IC packages ■Mainframe computers ■Computers, etc. *For more details, please refer to the PDF document or feel free to contact us.

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Kiyokawa Plating Industry Co., Ltd. Plating Technology

Kiyokawa Plating Industry Co., Ltd. Plating Technology

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清川メッキ工業

清川メッキ工業

Manufacturing and processing contract

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Through the miniaturization of products using our unique nano-plating technology, we promote resource conservation and energy efficiency to protect the global environment, ensuring that even hundreds of billions of components can be produced without a single defect, thereby providing safety and peace of mind to society. This philosophy will be passed down forever as long as the company continues, regardless of how times change. Kiyokawa Plating will continue to provide technology that is always needed by our customers, ensuring their satisfaction and inspiring them.

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