Supports square substrates other than standard wafer shapes, as well as thin substrates around 100μm, chips, and small pieces!
Micro bumps and fine wiring through "plating" are essential technologies for enhancing the performance and miniaturization of electronic devices, such as improving transmission characteristics by shortening wiring lengths. Our company handles the entire process, from the plating process to the preceding and subsequent patterning and etching processes. We can also accommodate plating for micro bump shapes and line shapes, as well as for micro patterns of several tens of micrometers. 【Features】 ■ Comprehensive support from sputtering to seed etching ■ Creation of micro patterns through electrolytic plating ■ Support for small-scale prototype processing ■ Prototyping possible from just one piece ■ Design of dedicated equipment *For more details, please refer to the PDF document or feel free to contact us.
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basic information
【Supported Substrates】 ■Size: 6 inch to 12 inch wafers ■Material: Si, SiC, glass, etc. *For more details, please refer to the PDF document or feel free to contact us.
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Applications/Examples of results
【Applications】 ■ASIC devices for MEMS ■Sensor devices ■Other devices *For more details, please refer to the PDF document or feel free to contact us.
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Through the miniaturization of products using our unique nano-plating technology, we promote resource conservation and energy efficiency to protect the global environment, ensuring that even hundreds of billions of components can be produced without a single defect, thereby providing safety and peace of mind to society. This philosophy will be passed down forever as long as the company continues, regardless of how times change. Kiyokawa Plating will continue to provide technology that is always needed by our customers, ensuring their satisfaction and inspiring them.