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  6. Embossed tapping (terminal pins, micro electronic components)

Embossed tapping (terminal pins, micro electronic components)

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last updated:Mar 22, 2024

ファインネクス 本社、東京支店、大阪支店、名古屋支店、ベトナム工場、シンガポール営業所
ファインネクス 本社、東京支店、大阪支店、名古屋支店、ベトナム工場、シンガポール営業所
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Increase production efficiency! We can offer embossed packaging tailored to customer specifications.

At FineNex, we offer taping services for terminal pins and fine electronic components according to our customers' requests. Embossed taping is a packaging method where terminal pins and fine electronic components are individually placed into recessed pockets and sealed with tape. We design and manufacture our original embossed packaging machines in-house, allowing us to propose embossed packaging tailored to our customers' specifications. Additionally, we can install image inspection devices on the embossed packaging machines. 【Features】 ■ Terminal pins and fine electronic components can be directly mounted onto the circuit board using the placement machine. ■ Reduces the takt time when mounting electronic components onto the circuit board. ■ Components are stored individually in pockets. ■ Reduces the risk of scratches and other damage to components during transport. ■ It is also possible to install image inspection devices on the embossed packaging machines. *For more details, please refer to the related links or feel free to contact us.

    Packaging materials
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Embossed tapping (terminal pins, micro electronic components)

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  • Related Link - https://www.finecs.co.jp/products/composite/1703.h…

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basic information

【Specifications】 ■ Width of embossed carrier tape: up to 8, 12, 16, 24, 32mm ■ Applicable reel size: up to φ380mm *For more details, please refer to the related links or feel free to contact us.

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ファインネクス

ファインネクス 本社、東京支店、大阪支店、名古屋支店、ベトナム工場、シンガポール営業所

Electronic Components and Semiconductors

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Through years of accumulated expertise in the plastic processing technology of wire materials, we are capable of producing a wide range of products, from micro pins with a wire diameter of φ100μm or less to large forged parts for automobiles, all through header forging processing. With over 2,000 in-house processing machines, we have established a mass production system for some of the world's leading forged components. For PGA terminals used in CPUs for personal computers, where we have achieved a top global market share, we supply over 10 billion units monthly, contributing to the advancement of the IT society. Leveraging our know-how in forging processing, we respond to the needs of customers across various fields, including consumer goods, automotive, and medical applications. Additionally, we possess a consistent manufacturing line that extends from forging processing to plating, press processing, insert molding, and assembly of components, allowing us to provide parts with higher added value by combining various processing methods, not just limited to forging. We also cater to a wide range of needs, including OEM assembly of high-quality parts such as automotive sensor components and other vehicle parts that require stringent quality standards.

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