Composite heat sink optimized for thermal expansion with thermal conductivity of 1000 W/mK.
This is a super high thermal conductivity heat sink that combines core material TPG with a thermal conductivity of 1500 W/mK and capsule material optimized for thermal expansion. It is suitable for packaging high-power, high-frequency semiconductor chips.
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basic information
- Thermal conductivity: 1000 W/mK - Compliant with MIL-STD-883H
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Applications/Examples of results
- Heat sink for power electronics packages - Heat sink for RF and microwave electronics packages - Heat sink for laser diodes - Heat sink for high-power LEDs
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Company information
Momentive Technologies Japan Co., Ltd. develops, manufactures, and sells high thermal conductivity heat sinks, heaters/electrostatic chucks, ceramic products, and corrosion/heat-resistant coatings. We also handle a wide range of quartz and silicone products. Please feel free to contact us when you need assistance.