Sintered at 120°C for 30 minutes. Low-resistance wiring material compatible with flexible substrates.
We have developed a low-resistance and flexible Ag wiring material using our proprietary metal powder dispersion technology and resin formulation technology. By adopting nano Ag as the conductive powder, we have achieved a volume resistivity of uΩ·cm. Since it exhibits low resistance even in thin films (<10um), it also enables cost reduction compared to conventional products.
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basic information
◆XKD10100 ・Processing temperature: 120C/30min ・Viscosity: 30Pa·s ・Specific resistivity: 7uΩ·cm ・Minimum adhesion thickness: >5um ・Printability (width): >50um ・Adhesion to flexible substrates: Good adhesion to PC/PET/PI/CNT attached to PC ・Applications: Flexible wiring, film heaters, etc.
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Applications/Examples of results
- Heater electrode - Wiring
Company information
Namix Corporation is a company engaged in the research, development, manufacturing, and sales of electrochemical materials. By refining the material technology cultivated since its founding and strengthening the development of new technologies, we propose products that realize our customers' potential needs.
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