High heat-resistant and film-curable adhesive
Attention those struggling with adhesives! =====Amazing Features of ZC-210===== 1. Non-spreading, Thixotropic Ratio = 3 2. Capable of thin film curing, approximately 0.1mm 3. Coating toughness 4. Heat resistance, Tg = 175℃ 5. Quick curing, cures in 10 minutes at 160℃ *For more details, please download the PDF or feel free to contact us.
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basic information
For more details, please download the PDF or feel free to contact us.
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Applications/Examples of results
【Applications】 - Semiconductor chip encapsulation - Measurement probe fixation *For more details, please download the PDF or feel free to contact us.
Detailed information
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Features of the "ZC-210"
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Download All Catalogs![[Product Catalog] High Heat Resistance & Thin Film Curing Adhesive_ZC-210](https://image.mono.ipros.com/public/catalog/image/01/07e/631297/IPROS74335948165506113281.jpeg?w=120&h=170)
Company information
Since our establishment in 1970, we have consistently built our products based on the technology and know-how we have cultivated as a resin formulator, while carefully responding to our customers' needs. We offer a lineup that includes not only epoxy products (liquid and powder) but also insulating materials based on urethane and silicone, as well as coating materials and conductive paste materials. Our applications range widely, primarily focusing on electronic components, but also including automotive parts, industrial equipment parts, sports goods, and everyday items. We deliver our products not only within Japan but also to Europe, China, Southeast Asia, and around the world.
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