Supports 11ac and Bluetooth(R) v5.0 BR/EDR/LE, low power consumption compact size SDIO SiP module.
The built-in RF front end reduces the development burden of RF peripheral circuits and allows control of both the 5GHz and 2.4GHz bands with a single external antenna. Additionally, its compact size of 6.9mm x 6.9mm contributes to the miniaturization of customer PCBs. 【Features】 ● Dual-band Wi-Fi & Bluetooth(R) v5.0 compatible ● Low power consumption 1x1 SiP module ● Utilizes Qualcomm's QCA9377-3 SoC ● Maximum PHY data rate of 433Mbps (when using 11ac VHT80) ● Equipped with a wireless LAN host interface compatible with SDIO3.0 ● Supports UART as a Bluetooth(R) host interface ● Main power supply: 3.3V, IO power supply: 1.8V or 3.3V ● Compliant with RoHS Directive (2011/65/EU) ● Compact size 6.9 x 6.9 x 1.1 mm ● 80-pin LGA package
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【Specifications】 ○Chipset: QCA9377-3 ○Host Interface: Wireless LAN: SDIO3.0, Bluetooth(R): UART ○Wireless LAN Specifications: IEEE 802.11a/b/g/n/ac (1x1) ○Antenna Connector: U.FL compatible connector x 2 ○Bluetooth? Specifications: Bluetooth? v5.0 (BR/EDR/LE compliant) ○Operating Voltage: Main Power: 3.3V, SDIO Power: 1.8V or 3.3V for SDIO2.0 operation, 1.8V for SDIO3.0 operation ○Weight: 0.2g ○Operating Environmental Conditions: Temperature: -20 to 70℃, Humidity: up to 85% RH (no condensation) ○Storage Environmental Conditions: Temperature: -40℃ to 85℃, Humidity: up to 85% RH (no condensation) ○Dimensions: 6.9×6.9×1.1mm ○Package Type: LGA 80 pins package ●For more details, please contact us or download the catalog.
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Silex Technology Corporation (Headquarters: Seika Town, Kyoto Prefecture) is a research and development-oriented company centered on hardware and software technology. We provide products and services that create a wireless environment with reliable connectivity using safe and high-reliability wireless technology and embedded know-how for devices and systems in the medical and industrial sectors. Through the creation of a "seamless wireless space," we realize the best customer experience. We are expanding our global business through collaboration with overseas partners and the development of new markets via our bases in North America, Europe, China, and India. By overseeing the entire process from design and development to production and quality assurance at our "Keihanna Headquarters," we maintain strict quality standards while also responding to diverse customer needs in each region under a development system that collaborates with overseas bases, including custom engineering on-site.