Case Study of Die Set Molding Processing for Electronic Devices: Beryllium Copper Stamping Processing
The stroke speed is 180 spm to 200 spm! Here are examples of processing done using the punching method in a progressive manner!
We would like to introduce a case study of our company's "beryllium copper punching processing" die set mold processing. The material width is 16.5mm, the material form is in rolls, and the product thickness is 0.05t. The punching method was performed in a progressive manner. We used the "Stamping Press Vrio-10" manufactured by KYORI, with a pressing capacity of 100kN and a stroke speed of 180spm to 200spm in a roll-to-roll configuration. [Processing Case Overview (Partial)] ■ Material: Beryllium Copper ■ Material Width: 16.5mm ■ Material Form: Roll ■ Product Thickness: 0.05t ■ Shape Tolerance: ±0.005 *For more details, please feel free to contact us.
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【Overview of Other Processing Examples】 <Die Specifications> ■Die Type: Die Set ■Punching Method: Progressive ■Punch Material: Powdered High-Speed Steel (HRC 65°) ■Die Material: SKD-11 *For more details, please feel free to contact us.
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Our company mainly develops and manufactures production equipment, focusing on precision molds, film punching molds, and press machines. We have factories located in Kanagawa, Tochigi, and Akita, and we supply products both domestically and internationally. By applying our experience and technology, we respond to customer demands and aim for high quality, challenging ourselves in manufacturing with flexible solutions. Please feel free to contact us with any inquiries.