Case Study of Die Set Molding Processing for Electronic Devices: Cover Film Cutting Processing
With a pressing capacity of 100 kN and a stroke speed of 60 spm! An example of punching from the upper side of a paper separator.
We would like to introduce a case study of our company's "Cover Film Die Cutting" die set mold processing. The material width is 250mm in roll form. The material composition consists of a heat-resistant carrier film of 50μm, a PI film of 9μm, an adhesive layer of 20μm, and a paper separator of 150μm, with a total thickness of 229μm. We used a "SSD1000-ASF automatic press machine with linear feeding device" manufactured by Sekiguchi Seisakusho, and the punching was performed from the upper side of the paper separator. 【Overview of Processing Case (Partial)】 ■ Material Composition: Total thickness 229μm - Heat-resistant carrier film 50μm - PI film 9μm - Adhesive layer 20μm - Paper separator 150μm ■ Material Width: 250mm ■ Material Form: Roll ■ Dimensional Tolerance: ±0.1mm *For more details, please feel free to contact us.
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【Overview of Other Processing Examples】 <Die Specifications> ■Die Type: Die Set ■Punching Method: Progressive ■Punch Material: SKH-51 ■Die Material: SKD-11 *For more details, please feel free to contact us.
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Our company mainly develops and manufactures production equipment, focusing on precision molds, film punching molds, and press machines. We have factories located in Kanagawa, Tochigi, and Akita, and we supply products both domestically and internationally. By applying our experience and technology, we respond to customer demands and aim for high quality, challenging ourselves in manufacturing with flexible solutions. Please feel free to contact us with any inquiries.