Leave the electroless plating (UBM) on wafers to us!
We perform electroless Ni/Pd/Au (Nickel/Palladium/Gold) and Ni/Au (Nickel/Gold) plating. In the flip chip method, the formation of UBM (Under Bump Metallization) is essential for the bonding of metal pads and solder. In the case of wire bonding, applying a Pd plating film serves as a buffer during the bonding process, and it also allows for the Au film to be made thinner. Please feel free to contact us if you have any requests. 【Devices that require plating (examples)】 ■ Power MOSFET ■ IGBT ■ Diode ■ SiC ■ GaN *For more details, please download the PDF or feel free to contact us.
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【Specifications (Excerpt)】 ■#2 Line (Manual) ・Wafer Size (inches): 4, 5, 6, 8, (12) ・Electrode Material: Al, Al-Cu, Al-Si, Al-Si-Cu, Cu ・Plating Types: Ni/Au, Ni/Pd/Au, Ni/Thick Au, Ni/Pd/Thick Au ■#3 Line (Automatic) ・Wafer Size (inches): 6, 8 ・Electrode Material: Al-Cu, Al-Si-Cu, Al-Si ・Plating Types: Ni/Au, Ni/Pd/Au ■#4 Line (Automatic) ・Wafer Size (inches): 6, 8 ・Electrode Material: Al-Cu, Al-Si-Cu, Al-Si ・Plating Types: Ni/Au, Ni/Pd/Au, Ni/Thick Au, Ni/Pd/Thick Au *For more details, please download the PDF or feel free to contact us.
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Our company offers a wide range of plating services, including Ni plating, Ag plating, Sn-Ag plating, Pd plating, and Sn-Pb plating. To respond flexibly to our customers' needs, we will confirm the requirements you seek and propose suitable solutions. Additionally, our company is also focused on research and development, and we accept development prototypes, so please feel free to consult with us.