Are you having any issues with glass cutting or etching processing?
- Cutting small pieces from large glass - Beveling - Grooving (glass etching)
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basic information
Work Size MAX 500x400 mm MIN 100x100 mm - Scribing is from 500x400 to 10x10 mm; anything smaller will undergo dicing processing. - Etching is up to 50% of the glass substrate.
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Applications/Examples of results
- Various evaluation sample substrates - Organic EL sealing caps
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Company information
Specifically, we receive requests for patterning processing on substrates for ACF, organic EL, material evaluation, MEMS, solar cells, and equipment evaluation using photolithography and etching technology from various companies, public research institutions, and research and development departments of universities. We specialize in fine pitch patterning of thin metal films, but we can also consider processing methods for thick films depending on the specifications, so please feel free to consult with us. Additionally, we also accept sputtering deposition processing only. We handle processing not only for glass substrates but also for various film substrates such as PC, PET, and PI. We also accept orders for substrate and film arrangement.
![[Processing Technology] About Glass Processing](https://image.mono.ipros.com/public/product/image/2c6/2000359447/IPROS76515372044766409345.jpeg?w=280&h=280)
