Supports thickness from 0.03mm! Distortion-free blank processing.
Nishino Seiki Manufacturing Co., Ltd. specializes in precision machining, and laser processing of thin plates is one of its strengths. One of the three laser processing machines owned is specifically designed for processing thin plates. **Features of Thin Plate Laser Processing** - Compatible plate thickness: 0.03 to 0.8 mm - High precision processing with ±0.03 accuracy - Minimum processing hole diameter: φ0.15 - Minimal thermal impact, resulting in a clean finish without distortion - Capable of laser processing high-reflectivity materials such as copper and pure aluminum Due to the ability to minimize distortion and achieve high precision, it can also handle the processing of thin products that require accuracy, such as terminals. There are numerous processing achievements for parts related to medical equipment, electronic components, and semiconductors. *For more details, please refer to the related links or feel free to contact us.*
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At Nishino Seiki Seisakusho Co., Ltd., we have a wide range of equipment and systems that can handle both sheet metal and press processing, as well as machining such as lathes and machining centers, allowing us to comprehensively meet all customer requests for prototypes and parts processing. We also manufacture dedicated molds and tools necessary for processing prototypes and products requested by customers, such as bending molds, punching molds, and drawing molds, in-house. This eliminates the need to outsource mold production, enabling us to achieve shorter lead times for processing. Additionally, we can quickly make creative adjustments, fine-tuning, and improvements to molds in-house, which significantly enhances the quality and precision of the finished products. We cover both sheet metal and press processing as well as machining within a single company, leveraging our uniquely developed processing technologies and know-how to challenge ourselves daily with the processing of fine, miniature parts and difficult materials.