Compatible with ACP and ACF! We will attach FPC to the boards processed by our company or the boards you provide!
We offer "FPC bonding processing." The alignment accuracy is ±0.2mm. We can accommodate ACP and ACF, and we can bond FPC to both processed substrates and supplied substrates. Processing is possible for glass substrates up to a maximum size of 300mm × 300mm. Please consult us separately regarding FPC sizes. 【Features】 <Processing Size> ■ MAX: Processing is possible for glass substrates up to 300mm × 300mm ■ MIN: 100mm × 100mm (FPC sizes are available for separate consultation) <Processing Accuracy> ■ Alignment: Accuracy ±0.2mm *For more details, please feel free to contact us.
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Specifically, we receive requests for patterning processing on substrates for ACF, organic EL, material evaluation, MEMS, solar cells, and equipment evaluation using photolithography and etching technology from various companies, public research institutions, and research and development departments of universities. We specialize in fine pitch patterning of thin metal films, but we can also consider processing methods for thick films depending on the specifications, so please feel free to consult with us. Additionally, we also accept sputtering deposition processing only. We handle processing not only for glass substrates but also for various film substrates such as PC, PET, and PI. We also accept orders for substrate and film arrangement.