Processing is possible for glass substrates up to 300mm × 300mm! There are examples such as Si, Pt, and Ta!
We offer "Lift-off processing" at our company. This is a technology for patterning thin films that are difficult to etch, where a reverse pattern is formed using resist, followed by the deposition of the required film. After deposition, the resist is removed. If the effective area is φ300mm, processing can be done on glass substrates up to a maximum size of 300mm × 300mm. 【Features】 ■ Patterning of thin films that are difficult to etch ■ Formation of a reverse pattern using resist, followed by deposition of the required film ■ Removal of resist after deposition ■ Specified deposition temperature (around 100°C) ■ Examples: Si, Pt, Ta, etc. *For more details, please feel free to contact us.
Inquire About This Product
basic information
【Processing Image】 ■Substrate Insertion ■Resist Coating ■Resist Patterning ■Film Formation Processing ■Resist Stripping *For more details, please feel free to contact us.
Price range
Delivery Time
Applications/Examples of results
【Processing Results】 ■L/S=5μm/5μm *For more details, please feel free to contact us.
catalog（2）
Download All Catalogs
Company information
Specifically, we receive requests for patterning processing on substrates for ACF, organic EL, material evaluation, MEMS, solar cells, and equipment evaluation using photolithography and etching technology from various companies, public research institutions, and research and development departments of universities. We specialize in fine pitch patterning of thin metal films, but we can also consider processing methods for thick films depending on the specifications, so please feel free to consult with us. Additionally, we also accept sputtering deposition processing only. We handle processing not only for glass substrates but also for various film substrates such as PC, PET, and PI. We also accept orders for substrate and film arrangement.