High-performance adhesive for camera modules.
This catalog introduces H.B. Fuller’s adhesives for electronics. We have a wide range of products applicable to the latest camera modules, including those for housing bonding, active alignment, die attach, and FPC reinforcement. Please make use of this for product selection. 【Featured Products (excerpt)】 - Low-temperature curing adhesives - UV curing adhesives - UV/thermal or UV/moisture dual curing adhesives - Underfill materials, etc. *For more details, please feel free to contact us.
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basic information
Bonding applications in camera modules and image sensors: • House bonding • Active alignment • Die attach • Glass attach • Flip chip side fill • Lens barrel bonding • Encapsulation • FPC reinforcement • Conductive grounding
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Sekisui Fuller Co., Ltd. is engaged in the manufacturing and sales of high-performance products centered around adhesives. Products utilizing adhesive technology are used in a wide range of fields, from everyday household items to industrial applications and large-scale construction and civil engineering sectors. In recent years, the demand for these products has become even more diversified. On the other hand, scrutiny regarding environmental impact has intensified, leading to higher standards of compliance required from manufacturers due to revisions in building codes and guidelines from the Ministry of Health, Labour and Welfare. In this market context, Sekisui Fuller has continued its relentless efforts to sustainably develop its business. We constantly capture the latest needs, develop new products through technological innovation, and strive to improve customer service. This has become a significant driving force for the growth of our business. Sekisui Fuller Co., Ltd. will continue to stay close to our users and the community, responding to the expanding market needs with prompt and meticulous service.