[Technology Introduction] Semiconductor Laser Cladding

Achieving high hardness and high purity meat layers! Introducing technology that enables thin coatings comparable to thermal spraying.

The "Semiconductor Laser Cladding" by Shin Nihon Yogyou Co., Ltd. is a construction technology that allows for buildup at a low heat input (2,500°C) compared to conventional methods. Due to the low heat input, it reduces thermal distortion and heat-affected zones. Benefits such as reduced post-processing costs from near-net shape laser cladding and performance improvements from high-quality, high-material-property surface modification layers due to low heat input and low dilution laser cladding can be expected. 【Features】 ■ Allows for buildup at low heat input (2,500°C) ■ Capable of thin buildup (0.4mm) comparable to thermal spraying ■ Reduces thermal distortion and heat-affected zones due to low heat input ■ Achieves a buildup layer with high hardness and high purity ■ Compared to PTA buildup, laser cladding has a penetration depth of 1/5 *For more details, please refer to the PDF document or feel free to contact us.

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