The company's equipment is designed for high-power applications such as power devices.
We have started handling the new ASMPT sintering equipment. The company's equipment has a proven track record for worldwide installations and provides solutions for high-power devices. The features of this equipment allow for the bonding of chips with varying sizes and thicknesses simultaneously, thanks to its uniform temperature and special bond head. Additionally, ASMPT has experience in Cu oxidation prevention measures and collaborates with many material manufacturers. Furthermore, we can offer a consistent solution for the sintering process, not only with the sintering equipment but also with multi-laser dicing machines, tacking machines, curing machines, and more. Product Types: - Manual machines for R&D - Semi-automatic machines for mass production - Fully automatic machines for mass production Please feel free to contact us for more details about the equipment.
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For high power applications such as power devices.
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Our company started in 1982 as a technical trading company specializing in the sales and maintenance services of semiconductor manufacturing equipment imported from overseas, as a group company of Kanematsu Corporation. Recently, in order to meet the diverse needs of our customers, we have been committed to ensuring that not only manufacturing equipment but also overseas products such as parts, materials, and subsystems can be used with confidence by our customers. While being a trading company, we have enhanced our technical department, which is responsible for planning, development, design, and manufacturing, to propose comprehensive technical solutions and expand our business globally to customers both domestically and internationally. In the future, we aim to continue being a company that provides new added value and services as an electronics technology trading company, growing together with our customers.
