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  6. Mount implementation

Mount implementation

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last updated:Jun 24, 2025

ケイ・オール
ケイ・オール
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Implementation in any payout state! We can respond quickly even from a single circuit board.

The features of K-All's "Mounter Implementation" are its ability to specialize in prototype production. In the case of prototype implementation, there may be instances where parts are inevitably supplied as cut or loose components. Our company can handle work with a mounter starting from just one piece, even with cut or loose supplies. 【Features】 ■ Capable of handling from one piece to medium lot and mass production ■ Efficient implementation suitable for various conditions ■ Capable of accommodating various types such as new package types, flexible substrates, and multilayer boards ■ Suitable mounter support ■ Difficult-to-obtain parts can be added later ■ Free provision of CR stock during prototyping *For more details, please refer to the PDF document or feel free to contact us.

    Contract manufacturing
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Mount implementation

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2022-06-03_15h50_18.png
  • Related Link - https://www.kei-all.co.jp/mounting/smt/
  • Special site - Product/service details - https://pr.mono.ipros.com/kei-all/product/

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basic information

Efforts to Create Quality Products ■ Establishing a system that allows for a clear understanding of implementation details by creating unique drawings ■ Managing moisture-sensitive devices and circuit boards at MacDry (1% humidity) before implementation ■ Performing reflow under stable N2 atmosphere conditions using a nitrogen generation device ■ Conducting inspection of at least one implemented unit at each stage ■ For components such as BGA and QFN, where soldering conditions cannot be visually inspected, conducting X-ray inspection for all units and performing solder inspection within the process before handing over to the next stage *For more details, please refer to the PDF document or feel free to contact us.*

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[Proven Track Record] ■ Mounting at temperatures suitable for various substrates using know-how in creating reflow temperature profiles ■ High-difficulty implementations related to aerospace and defense *For more details, please refer to the PDF document or feel free to contact us.

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Technical Document "Underfill BGA Rework Technology"

Technical Document "Underfill BGA Rework Technology"

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Excerpt of Prototype Parts Implementation Know-How

Excerpt of Prototype Parts Implementation Know-How

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Company information

ケイ・オール

ケイ・オール

Manufacturing and processing contract

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Our company was founded in 1990 with four members. At the time of our establishment, we had no equipment, and each of us primarily worked on renovation projects and manual assembly with just a soldering iron. As the miniaturization of components progressed and the number of prototype and development projects involving BGA increased, so did the demand for BGA reballing and jumper wiring. Therefore, we introduced BGA rework equipment before implementing basic devices such as reflow ovens. Since then, we have conducted extensive research in technology alongside numerous customers, and we take pride in having established a level of reliability that satisfies our clients, not only for BGA but also for LGA, POP, underfill applications, and 0402 chip mounting. Other features of our company include the establishment of a RoHS-compliant factory, maintaining a constant inventory, and providing mounting support for cut parts (My Data), which differentiates us from other companies in the same industry. It is our mission to respond to all QCD (Quality, Cost, Delivery) requirements necessary for development and prototype assembly, and we are committed to providing technical support with customer satisfaction as our top priority.

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