【Technical Data Presentation】Achieving 3,000 cases annually! Capable of supporting both eutectic and lead-free! Packed with technical information such as BGA reballing that regenerates solder balls!
At K-All, we have accumulated various work methods and technical research, enabling rework operations even on devices coated with various underfill materials! Using techniques such as replacement, re-implementation, re-balling, re-heating, underfill filling, BGA jumpers, and POP implementation for BGA, LGA, QFN, etc., we solve various issues related to circuit boards and devices. In this document, we present technical materials regarding BGA rework technology. Hardened underfill materials seal the BGA, significantly improving strength and effectiveness; however, rework tasks such as removal and component replacement become more challenging than standard rework processes. Our company has been working diligently to ensure that rework operations can be performed even on devices coated with various underfill materials. [Features of Underfill] - Uses a one-component heat-curing epoxy resin - Can reduce external stress - Prevents stress concentration on the connection surface of solder balls - Widely used in mobile devices, including mobile phones *For more details, please contact us or download the catalog!
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basic information
**What is Underfill?** BGA is mounted on the printed circuit board using solder balls. Due to weak connection strength, there may be cases where the reliability of the connection cannot be maintained due to the detachment of the BGA or the occurrence of cracks at the solder joints under external stresses such as impact or bending. To address these issues and improve connection reliability, a sealing resin called underfill is used in the gap between the component and the board. Typically, a one-component heat-curing epoxy resin is used as the underfill material for BGA encapsulation. This resin is applied in liquid form, penetrates the gap between the component and the board due to capillary action, and cures upon heating. By applying the underfill material, external stresses can be reduced, and it helps prevent stress concentration at the connection surface of the solder balls. Underfill materials are widely used in mobile devices, including mobile phones and music players. For more details, please contact us or download the catalog.
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Company information
Our company was founded in 1990 with four members. At the time of our establishment, we had no equipment, and each of us primarily worked on renovation projects and manual assembly with just a soldering iron. As the miniaturization of components progressed and the number of prototype and development projects involving BGA increased, so did the demand for BGA reballing and jumper wiring. Therefore, we introduced BGA rework equipment before implementing basic devices such as reflow ovens. Since then, we have conducted extensive research in technology alongside numerous customers, and we take pride in having established a level of reliability that satisfies our clients, not only for BGA but also for LGA, POP, underfill applications, and 0402 chip mounting. Other features of our company include the establishment of a RoHS-compliant factory, maintaining a constant inventory, and providing mounting support for cut parts (My Data), which differentiates us from other companies in the same industry. It is our mission to respond to all QCD (Quality, Cost, Delivery) requirements necessary for development and prototype assembly, and we are committed to providing technical support with customer satisfaction as our top priority.
![[Data] Resin Material Selection Flowchart Vol. 2](https://image.mono.ipros.com/public/product/image/36d/2001015261/IPROS46458698693986511061.png?w=280&h=280)