Customized production tailored to your needs! Used in the die bonding process during semiconductor manufacturing.
The "Uplift Pin Holder" is used in the die bonding process during semiconductor manufacturing to pick up chips from the dicing tape. It can maintain needle verticality, with a needle height variation within ±25μ, and features a mechanism to prevent needle detachment. We can customize it according to your application, so please feel free to contact us. 【Features】 ■ Used to pick up chips from the dicing tape ■ Maintains needle verticality ■ Needle height variation within ±25μ ■ Prevents needle detachment *For more details, please refer to the related links or feel free to contact us.
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【Usage】 ■Semiconductor manufacturing *For more details, please refer to the related links or feel free to contact us.
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Taisho Corporation was founded in the lush green city of Kawagoe to develop semiconductors, LCDs, vacuum, and cooling devices, as well as to engage in precision product processing. As part of our corporate social responsibility, we promote activities that consider environmental conservation and contribute to the realization of a prosperous society through the creation of environmentally harmonious products.