Glass, ceramics, crystalline materials, various substrates, etc.! Leave contract processing and difficult machining to us!
We would like to introduce the dicing technology 'Dicing Processing' held by Shinko. Tape dicing achieves a reduction in scratches, dirt, and foreign material attachment, as well as cost reduction. Additionally, we can perform alignment cutting using various software, suppress and remove burrs (plating and metallization), and support high-pressure nozzles and two-fluid spin cleaning machines. We respond to customer needs with reliable quality from small-scale prototypes to mass production. 【Features】 ■ Tape Dicing: Reduction of scratches, dirt, and foreign material attachment, cost reduction ■ Square Chuck Table: Supports large substrates and reduces costs through multi-layer processing ■ Alignment cutting using various software ■ Suppression and removal of burrs (plating and metallization) ■ Capable of cutting and grooving thick materials (up to t10mm) ■ Compatible with high-pressure nozzles and two-fluid spin cleaning machines *For more details, please refer to the PDF document or feel free to contact us.
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basic information
【Processed Materials】 ■ Glass (Tempered glass, borosilicate, non-alkali, quartz, etc.) ■ Ceramics (Alumina, aluminum nitride, silicon nitride, zirconia, PZT, etc.) ■ Crystal materials (Silicon, sapphire, quartz, GOS, ZnO, etc.) ■ Various substrates (Resin substrates, metallized substrates, optical coated substrates, composite material substrates, special material substrates, etc.) *For more details, please refer to the PDF document or feel free to contact us.
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Applications/Examples of results
【Fields】 ■ Optical communication equipment-related components - Smartphones, optical transceivers, semiconductor lasers, heat sinks, Peltier modules, etc. ■ Optical equipment components - Aspherical lenses, cylindrical lenses, micro-lens arrays, wave plates, etc. ■ Automotive-related components - Sensors, thermoelectric modules, cover glass, etc. ■ Medical device-related components - CT, ultrasound, deep ultraviolet LEDs, denture materials, etc. ■ Office equipment-related components - Printers, projectors, etc. *For more details, please refer to the PDF document or feel free to contact us.
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Company information
Shinko Co., Ltd. is a company located in Uonuma City, Niigata Prefecture, engaged in material development, precision processing of hard materials, and inspection contract services. Our company has been certified by Mitsuke City as a "Mitsuke SDGs Partner," a business or organization promoting SDGs together with Mitsuke City. With our capability to respond from prototyping to mass production and our high-precision processing technology, we meet various needs such as new product development, and we can provide integrated production support from material manufacturing to thin film microprocessing. We also accommodate a wide range of processes, from material manufacturing and fine processing to photolithography and inspection services.
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