No subsequent peeling process! Introducing grinding processing that leads to reduced lead time and cost savings.
"Wrapping processing (double-sided polishing)" performs high-precision polishing of various ceramics for electronic components, single crystal materials, optical glass, quartz, and other materials. We own models ranging from 4B to 9B and have a rich variety of polishing carriers, allowing us to respond flexibly based on processing quantities. Additionally, we can adjust surface roughness according to the type and grit of the polishing material. You can consult with us regarding processing methods tailored to your specifications and materials. 【Features】 ■ No adhesive or peeling processes involved ■ Leads to reduced lead times and cost savings ■ Models range from 4B to 9B, with a wide selection of polishing carriers available ■ Surface roughness can be adjusted based on the type and grit of the polishing material ■ Processing methods can be discussed to match customer specifications and materials *For more details, please refer to the PDF document or feel free to contact us.
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【Work Size and Specifications】 ■ Work Size: Up to φ100mm (□100mm), t0.05mm and above ■ Machining Accuracy: ±0.001mm and above ■ Surface Roughness: Ra > 0.10μm *For more details, please refer to the PDF document or feel free to contact us.
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[Processed Materials] ■ Ceramics (Silicon Nitride [SiN]), Alumina, Zirconia, Aluminum Nitride (AlN), Barium Titanate, Strontium Titanate, Glass, Quartz, Silicon Carbide (Ceramic, Single Crystal), Quartz, Sapphire *For more details, please refer to the PDF document or feel free to contact us.*
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Shinko Co., Ltd. is a company located in Uonuma City, Niigata Prefecture, engaged in material development, precision processing of hard materials, and inspection contract services. Our company has been certified by Mitsuke City as a "Mitsuke SDGs Partner," a business or organization promoting SDGs together with Mitsuke City. With our capability to respond from prototyping to mass production and our high-precision processing technology, we meet various needs such as new product development, and we can provide integrated production support from material manufacturing to thin film microprocessing. We also accommodate a wide range of processes, from material manufacturing and fine processing to photolithography and inspection services.