Data collection can be done in a short time! No pre-treatment is required, and samples can be reused.
Our company offers wafer surface analysis using the KLA-Tencor "Candela CS-10V." The Candela can detect microscopic defects as image data. Both the defect occurrence map and the status of individual defects can be observed. The target materials are sapphire, SiC, GaN, and other compound semiconductors, with applicable sizes ranging from φ2 inches to φ6 inches wafers (thickness less than 1mm). 【Features】 ■ Measurement data can be collected in a short time ■ No pre-treatment is required, and samples can be reused ■ Detection of microscopic defects that cannot be confirmed with an electron microscope ■ Applicable sizes: φ2 inches to φ6 inches wafers (thickness less than 1mm) *For more details, please refer to the PDF document or feel free to contact us.
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basic information
【Target Materials】 ■ Sapphire ■ SiC ■ GaN ■ Other compound semiconductors *For more details, please refer to the PDF document or feel free to contact us.
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【Usage】 ■Defect Analysis ・Scratch ・Bit (Cavity Defect) ・Bump (Convex Defect) ・Stain (Chemical Residue) ■Particle Detection *For more details, please refer to the PDF document or feel free to contact us.
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Company information
Shinko Co., Ltd. is a company located in Uonuma City, Niigata Prefecture, engaged in material development, precision processing of hard materials, and inspection contract services. Our company has been certified by Mitsuke City as a "Mitsuke SDGs Partner," a business or organization promoting SDGs together with Mitsuke City. With our capability to respond from prototyping to mass production and our high-precision processing technology, we meet various needs such as new product development, and we can provide integrated production support from material manufacturing to thin film microprocessing. We also accommodate a wide range of processes, from material manufacturing and fine processing to photolithography and inspection services.