Metallization (for bonding) as the base layer for soldering optical components and electronic components.
■Overview A metallization layer is formed to join non-metals such as glass and ceramics through soldering.
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■Features and Strengths - Optimal membrane types and configurations according to purpose - We can customize the membrane configuration not only with standard configurations but also according to the customer's objectives. - Free layout with fine patterning processing - The metallization layer can be laid out using fine patterning processing, allowing for wiring and electrodes. - Combination with functional films is possible - It is possible to combine with various high-performance thin films from Geomatec, such as anti-reflective films and optical filters. ■Example Specifications - Substrate size: φ8 inches - Membrane configurations: Cr/Ni/Au, Cr/Pt/Au, Ti/Ni/Au, Ti/Pt/Au, etc. - Film thickness: 0.05µm / 0.1µm / 0.2µm - Solder type: AuSn (gold-tin) * We do not accept the formation of solder. We can introduce cooperating manufacturers as needed. * We are also considering support for specifications other than those listed above. Please contact us first.
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Applications/Examples of results
- Optical elements and MEMS packages: A metallization layer for the solder base of window materials that achieves a hermetic package for optical elements such as optical sensors, LEDs, and semiconductor lasers. It is also possible to add anti-reflective coatings and optical filters. - Wiring and electrodes for electronic devices: For solderable wiring and electrodes.
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We are a specialized manufacturer of thin film processing technology. ----- Expanding Business Areas. ----- New products are continuously being introduced to society. Customer needs for vacuum deposition technology are becoming more advanced and diverse every day. At Geomatec, we strive to improve our technology while holding discussions with our customers, and we aim to respond to their various requests as much as possible.