Introducing a blast treatment that demonstrates powerful effectiveness in removing dross and smear after laser processing.
Fine powder processing by blasting refers to the precise processing of fine particles at a micron level, propelled at high speeds. It demonstrates powerful effects in roughening the substrate surface, engraving, and removing dross and smear after laser processing. The dry films used for blasting in industrial applications are applied to LCDs, organic EL displays, silicon wafers, and more. [Grinding Materials Used] - Alumina - Glass beads - Silicon carbide *For more details, please refer to the PDF document or feel free to contact us.
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basic information
【Recommended Machine】 ■ PAM Type Fine Powder Blast System *For more details, please refer to the PDF document or feel free to contact us.
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Applications/Examples of results
【Processed Products】 ■ PCB printed circuit boards, light guide plate molds, organic EL, silicon wafers ■ PDP evaluation test machines, ceramic processing, desmear removal *For more details, please refer to the PDF document or feel free to contact us.
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Company information
Established in 1959. One of the few long-established blast manufacturers in Japan. Headquartered in Taito-ku, Tokyo, it manufactures machines related to surface treatment, including shot blasting, air blasting, and wet blasting. It has production and sales bases in China and Thailand, and operates globally.