True roundness 5μ, compatible with ~6.5 inches! High-precision "semiconductor outer diameter polishing machine."
High-precision processing of various materials such as quartz, liquid crystal glass, molybdenum, sapphire glass, and diamond from silicon wafers!
The semiconductor peripheral grinding machine "PEG-100-3S" is a diamond grinding machine capable of high-precision processing at 5μm for various materials, including silicon wafers, glass, quartz, and metals. It can process materials such as silicon wafers, quartz, LCD glass, molybdenum, sapphire glass, and diamond, which are difficult to cut. Additionally, due to its contour processing method, it can handle various shapes, and changing the processing pressure is easy. It has a proven track record of processing thin materials, including 0.2mm glass. It can accommodate not only perfect circles but also convex and concave shapes, allowing for complex geometries. 【Features】 ■ Contour processing method with pneumatic pressure control ■ Large touchscreen panel ■ Inverter-controlled high-speed spindle ■ Grinding wheel shaft is driven by an inverter-controlled motor, allowing variable speed *For more details, please download the PDF or feel free to contact us.
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basic information
【Specifications】 ■ Machine Size: 1322(W) × 930(D) × 1115(H) ■ Machine Weight: 350 Kgf ■ Grinding Method: Profile grinding using a template gauge ■ Main Body Size: 780(W) × 704(D) × 390(H)
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Applications/Examples of results
Polishing of silicon wafers, quartz, liquid crystal glass, molybdenum material, sapphire glass, and diamonds.
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Company information
Our company manufactures and sells lens processing machines for glasses and semiconductor peripheral polishing machines. We handle innovative frame tracers that accommodate high curves, such as the 'FUJI-300TX PLUS/FUJI-300TX', so please feel free to contact us if you have any requests.