There are no obstacles on the surface, allowing for the incorporation of various types of parts for extraction processing and simultaneous machining.
This adhesive fixing processing method allows for the simultaneous processing of various types of components without any obstacles on the surface, enabling extraction processing. It is not limited to combinations of components with the same thickness; components with a few millimeters of thickness difference can also be incorporated into a single data set for simultaneous processing. This method is used for what is known as low-volume, high-variety parts processing. It is a "patchwork technique" made possible by adhesive processing. *For more details, please refer to the PDF materials or feel free to contact us.*
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General Chamfering Process In a typical chamfering process, a chamfer cutter is used. When using clamps for chamfering, the clamps can get in the way, leading to two additional steps for changing the clamps. Even with a five-axis machining center, it is not possible to chamfer the backside of the material, so the material needs to be flipped over. This requires two additional steps for the backside, resulting in a total of four steps, which incurs labor costs for the changeover work. Additionally, there are concerns about quality due to human intervention, such as scratches or misalignment during the changeover.
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Meiwa's Unique Chamfering Process (Pascal Processing) 【What is Pascal Processing?】 Our unique Pascal processing method uses a custom Pascal cutter, allowing for chamfering on both the front and back surfaces in a single process (this applies only when the back surface requires chamfering). Of course, we can process multiple pieces simultaneously from a single table, so workpiece replacement for many products can be done in one go. Everything is controlled by the machine's program in one process, ensuring stable quality supply.
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Our company conducts various experiments with double-sided tape and uses a solvent that allows for easy peeling, contributing to many fields through our bonding processing and easy peeling technology. We are confident that this technology offers significant benefits to our customers, especially for thin and small items. We perform high-precision processing with a processing range of 1,050mm x 560mm and a processing accuracy of around 10 microns. Please feel free to contact us.