Electroconductive dummy ball for plating (plating dummy ball)

We completely revamped the production process, achieving a balance between precision requirements and cost.

Our company handles "Conductive Dummy Balls for Plating (Plating Dummy Balls)" used in the plating process of passive components such as chip resistors and chip capacitors. We also offer micro balls smaller than 0.5mm used in advanced plating processes. Additionally, we recycle used balls that have become larger in diameter through a "clean regeneration" process that does not use any chemicals, significantly reducing environmental impact. 【Features】 ■ Management of sphericity and dimensional tolerances at the micron level to eliminate ball contamination in products. ■ Improved sphericity allows for repeated use in plating processes, enabling expansion to larger products and extending lifespan. ■ Reduces running costs and enhances trust in products. ■ Eligible for Tokyo Metropolitan Management Innovation Plan, Kanagawa Prefecture Manufacturing Subsidy, Taito Ward Industrial Promotion Agency New Business Subsidy. *For more details, please download the PDF or feel free to contact us. <Contact Information> 3F Sankei Nakata Building, 7-14-2 Ueno, Taito-ku, Tokyo 110-0005 Phone: 03-3841-2172 Contact: Kikuchi

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