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Our company manufactures "thick copper and high current (coil) substrates," which allow for the selection of circuit formation methods based on conductor thickness. If the conductor thickness is 300μm or more, half-etching can be accommodated. This method can reduce the difference between the top and bottom widths of the pattern compared to conventional etching methods, minimizing current loss relative to design values. 【Features】 ■ As a printed circuit board, the conductor thickness, circuit width, layout, and dielectric properties can be freely modified according to the required specifications. ■ Suitable for prototyping and development purposes. *For more details, please download the PDF or feel free to contact us.
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Since our establishment in 1973, our company has specialized in the planning, design, and manufacturing of printed circuit boards. In addition to the technology and know-how we have accumulated over the years, we have continuously gathered cutting-edge technology and introduced new equipment to meet our customers' needs. By providing friendly and appropriate planning and proposals for various customer concerns and ideas, we continue to earn the trust of our customers. Please feel free to consult us when you have any requests.
