Our factory line supports prototype, small quantity, and high-difficulty products! Introducing the pre-process and post-process of component mounting!
We would like to introduce our "Component Mounting (Front Process and Back Process)." Both the front and back process lines at our own factory are equipped to handle prototypes, small quantities, and high-difficulty products. Additionally, our partner factory lines can flexibly accommodate mass production and medium-quantity items. 【Front Process Equipment】 ■ Solder Printing - Jet Printing - Metal Mask Printing ■ SMD Mounting - SMD Mount ■ Reflow - Reflow Equipment *For more details, please refer to the PDF document or feel free to contact us.
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【Post-Process Equipment】 ■PBF & Eutectic Solder ■Solder Dip Equipment *For more details, please refer to the PDF document or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
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Hano Manufacturing Co., Ltd. has manufacturing facilities capable of in-house integrated production of printed circuit boards, focusing on small-batch production of various types. We handle the design and manufacturing of high-density, multi-layer printed circuit boards, as well as the development of electronic products, assembly, and performance testing. We also design and produce various nameplates, film sheets, and panel casing processing that correspond to the exterior of electronic devices, aiming for comprehensive coordination in electronic device development.
