The thermal conductivity of copper inlay is 390 W/mK! It can efficiently dissipate heat to the heat sink.
With the increase in signal high frequency, there is a tendency for the heat generation from components to increase, and the heat generated from individual circuit components also rises due to the increase in electrical power of the circuit. If these components are used without sufficient heat dissipation, issues such as unstable operation, reduced output, and decreased reliability may occur. By embedding a copper inlay, which is a metal with good thermal conductivity, directly beneath the mounted components, it is possible to efficiently dissipate heat to the heat sink. Our company can accommodate everything from double-sided boards to multilayer boards, and we can use materials such as FR-4, high Tg materials, and high-frequency materials. Please contact us for details regarding configuration and materials. 【Features】 ■ Directly dissipates heat from mounted components to the heat sink ■ Thermal conductivity of copper inlay: 390W/mK ■ Compatible with double-sided boards to multilayer boards ■ Materials available include FR-4, high Tg materials, and high-frequency materials *For more details, please refer to the PDF document or feel free to contact us.
Inquire About This Product
basic information
For more details, please refer to the PDF document or feel free to contact us.
Price range
Delivery Time
Applications/Examples of results
For concerns like this: ■ The temperature of the installed components is rising too high, causing unstable operation. *For more details, please refer to the PDF document or feel free to contact us.
catalog（1）
Download All Catalogs
Company information
Morimar SSP Co., Ltd. is engaged in the development, manufacturing, processing, and sales of various synthetic resins and chemicals, as well as their raw materials. Utilizing the production systems of the Morimar Group both domestically and internationally, we are expanding our global initiatives across a wide range of products, including FRP raw materials and molded products, glass fibers, printed circuit boards, resin raw materials, and functional films, targeting markets both in Japan and abroad.