Increased productivity with precision blasting processing on wafers! Simple operation by just setting the workpiece on the front.
The "Back Surface Roughening for LED Sapphire Wafers" is a device compatible with wafer sizes of 6 inches or less. It automatically processes the workpiece simply by setting it on the front of the main unit, and can precisely set the processing roughness to approximately Ra = 1μm, making it superior in roughness uniformity compared to lapping machines. The cutting amount can also be precisely controlled, processing a 6-inch wafer in under 70 seconds per piece. 【Features】 - Compatible with wafer sizes of 6 inches or less - Can precisely set processing roughness to approximately Ra = 1μm - Superior roughness uniformity compared to lapping machines - Cutting amount can also be precisely controlled - Processes a 6-inch wafer in under 70 seconds per piece *For more details, please feel free to contact us.
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Since the development of cabinet-type equipment in 1957, Fuji Manufacturing has accumulated its technology and achievements as a dedicated manufacturer of sandblasting equipment. Utilizing the sandblasting processing technology and know-how we have built up to this point, we provide various "functional surfaces" to address the diverse issues and challenges in the market. ■ Defects, challenges, and problems in production sites ■ Mold-related issues such as "molding defects" and "yield issues" We have numerous examples of improvements and achievements related to the above content! ⇒ For instance, improvements in "moldability" and "release properties" in plastic molds... Please feel free to consult with us.