Arradiance's tabletop ALD device can be equipped with a plasma unit despite being a tabletop model, and it is capable of film deposition not only for oxide films but also for nitrides, Pt, and Ru.
Despite being a compact tabletop ALD device, it enables atomic-level layer deposition. There is also a PEALD device equipped with a plasma unit. It can deposit on structures with a diameter of up to 200mm and a height of 25mm, as well as on carbon nanotubes (CNT) and graphene. In addition to oxide films, it also supports the deposition of nitrides and metals such as Pt and Ru. It features a 300W air-cooled direct ICP plasma head with four mass flow controlled plasma and gas inputs, and a reactor temperature adjustable up to 300°C. It includes a material supply pressurization assist function for low vapor pressure applications. The sample stage can accommodate substrates up to 200mm in diameter, and a 450°C heated stage is also available. The Arradiance GEMFlow software is user-friendly and allows for easy creation of deposition recipes. It controls all major operational parameters, including temperature, gas flow, high-speed ALD valves, RF power, and vacuum isolation. A diagnostic system and logs enable tracking of all system parameters during operation. Regarding RGIP (Reactor Gas Injection Protocol), it is equipped with a gas port monitoring interlock function.
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basic information
Features - A compact tabletop ALD device that is ideal for laboratory experiments and as a second dedicated ALD system. - Easy creation of deposition recipes with user-friendly software. - Optional plasma unit can be easily installed. Deposition Materials Al2O3, SiO2, HfO2, TiO2, ZnO, TiN, Pt, Ru, etc. For more details, please contact us. Substrates Structures ranging from 4 to 8 inches, up to approximately 25mm in height. Deposition is also possible on powders, carbon nanotubes (CNT), and graphene. Number of Channels Up to 8 types of precursors can be equipped. Chamber Temperature Up to 300°C (optional 450°C). Options Ozone generator, remote plasma device, powder coating fixtures (for coating quantum dots and nanoparticles), and Load Lock are also available. For more details, please contact us. (We also offer deposition services (for a fee). For more details, please contact us.)
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Supports a wide range of film materials: Al2O3, SiO2, HfO2, TiO2, ZrO2, TiN, Pt, Ru, etc. *For details on film materials, please contact our sales department.
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Tabletop Thermal/Plasma-Assisted Atomic Layer Deposition Device (ALD/PEALD) GEMStar XT Series Despite its compact tabletop size, it enables film deposition at the atomic level. It can deposit films on structures with a diameter of up to 200mm and a height of approximately 25mm, including carbon nanotubes (CNT) and graphene. In addition to oxide films, it also supports the deposition of nitrides and metals such as Pt and Ru. A variety of options, including a plasma generation unit, are available.
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As a technology trading company, we leverage our years of experience in the sales of various 3D printer devices with different molding methods and semiconductor manufacturing equipment, as well as after-sales maintenance services, to provide our customers with total solutions, including application support. In the field of 3D printer devices, we handle three main types of metal additive manufacturing methods: electron beam powder bed, laser powder bed, and laser deposition, allowing us to make proposals suitable for our customers' applications. We also sell metal powders with high hardness and high wear resistance characteristics for metal 3D printers. Furthermore, in the field of semiconductor manufacturing equipment, we also handle atomic layer deposition (ALD) devices.