Introducing a processing method often used for parts and products that require surface polishing!
"Wrapping processing" refers to a processing method in which a product is placed on a flat, disc-shaped platform called a lap plate, liquid abrasive is poured over it, and pressure is applied from above and below to perform polishing. It is also referred to as lap processing, and when specifically performed for the purpose of achieving a mirror finish, it is called lap finishing. Common applications include wafers, which are materials used in semiconductor manufacturing, as well as lenses for cameras and microscopes. It is often used for parts and products that require surface polishing. 【Features】 ■ A processing method that applies pressure from above and below for polishing ■ Known as lap processing or lap finishing ■ Processing applications - Wafers, which are materials used in semiconductor manufacturing, and lenses for cameras and microscopes - Often used for parts and products that require surface polishing *For more details, please refer to the PDF document or feel free to contact us.
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【Estimation to Order is Simple】 ■ Please send the drawings via email ■ Quotation response within 24 hours ■ If price and delivery time are acceptable → Place your order *For more details, please refer to the PDF document or feel free to contact us.
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【Usage】 ■ Used for wafers, which are materials for semiconductor manufacturing, as well as lenses for cameras and microscopes. ■ Often used for parts and processed products that require surface polishing. *For more details, please refer to the PDF document or feel free to contact us.
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Gate Japan Co., Ltd. is a company that responds quickly and accurately to customer needs worldwide, adhering to a customer-first principle. We have a broad overseas network centered in the Asia region, allowing us to identify the specific conditions required by each customer and propose the world's optimal production that meets those needs. We address various challenges such as diverse product types, short delivery times, small lot sizes, and cost reduction, adapting to the purpose, materials, and characteristics involved to solve your problems.
![[Grinding/Processing Method Introduction] Lapping Process (Double-Sided Grinding)](https://image.mono.ipros.com/public/product/image/7b9/2000717380/IPROS31978723393873754772.png?w=280&h=280)
![Metal and resin processing [Cutting, machine processing, particularly strong in lathe processing]](https://image.mono.ipros.com/public/product/image/2074611/IPROS2469409278451278262.png?w=280&h=280)
